Numerical and Experimental Analysis of Thermal–Hydraulic Behavior in Heat Pipe Systems
Article Sidebar
Main Article Content
Heat pipes are highly efficient passive thermal management devices widely used in electronics cooling, energy systems, and aerospace applications due to their excellent heat transfer capability. This paper presents a comprehensive numerical and experimental investigation of the thermal–hydraulic behavior of a heat pipe system under varying heat input and operating conditions. A detailed numerical model is developed to simulate heat transfer, fluid flow, phase change, and pressure distribution within the evaporator, adiabatic, and condenser sections. The numerical results are validated through controlled experimental testing, focusing on temperature distribution, thermal resistance, heat transfer coefficient, and working fluid dynamics. The comparative analysis demonstrates good agreement between numerical predictions and experimental observations, confirming the accuracy of the proposed model. The results reveal the influence of heat input, working fluid behavior, and wick structure on overall thermal performance and hydraulic stability. The findings provide valuable insights for optimizing heat pipe design and enhancing their reliability and efficiency in advanced thermal management applications.
Downloads
References
M. Cerza, B. Boughey, 2003, The Effects of Air Infiltration on a Large Flat Heat Pipe at Horizontal and Vertical Orientations, ASME Journal of Heat Transfer, Vol. 125, pp. 349–355.
Wang, Y., Vafai, K., 2000, An Experimental Investigation of the Transient Characteristics of a Flat Plate Heat Pipe During Start-Up and Shutdown Operations, Journal of Heat Transfer, ASME, Vol. 122, pp. 525–535.
H. B. Ma, C. Wilson, Q. Yu, K. Park, U. S. Choi, Murli Tirumala, 2006, An Experimental Investigation of Heat Transport Capability in a Nanofluid Oscillating Heat Pipe, Journal of Heat Transfer, ASME, Vol. 128, pp. 1213–1216.
Qingjun Cai, Chung-Lung Chen, Julie F. Asfia, 2006, Operating Characteristic Investigations in Pulsating Heat Pipe, Journal of Heat Transfer, ASME, Vol. 128, pp. 1329–1334.
Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Masataka Mochizuki, 2007, Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling, Journal of Heat Transfer, ASME, Vol. 129, pp. 1445–1452.
Balram Suman, Nazish Hoda, 2007, On the Transient Analysis of a V-Shaped Microgrooved Heat Pipe, Transactions of the ASME, Vol. 129, pp. 1584–1591.
Monica F. Bonadies, Mark Ricklick, J. S. Kapat, 2012, Optimization of a Phase Change Thermal Storage Unit, Journal of Thermal Science and Engineering Applications, Vol. 4, pp. 011007-1–9.
Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura, 2012, New Thermal Management Systems for Data Centers, Journal of Thermal Science and Engineering Applications, Vol. 4, pp. 031005-1–10.
C. Wilson, B. Borgmeyer, R. A. Winholtz, H. B. Ma, D. Jacobson, D. Hussey, 2011, Thermal and Visual Observation of Water and Acetone Oscillating Heat Pipes, Journal of Heat Transfer, ASME, Vol. 133, pp. 061502-1–5.
Wessel W. Wits, Jim B. W. Kok, 2011, Modeling and Validating the Printed Circuit Board Technology, Journal of Heat Transfer, ASME, Vol. 133, pp. 081401-1–10.
Chen-Ching Ting, Chien-Chih Chen, 2011, Developing the Coaxial Dual-Pipe Heat Pipe for Applications on Heat Pipe Cooler, Journal of Heat Transfer, ASME, Vol. 133, pp. 092901-1–7.
S. M. Thompson, A. A. Hathaway, C. D. Smoot, C. A. Wilson, H. B. Ma, R. M. Young, L. Greenberg, B. R. Osick, S. Van Campen, B. C. Morgan, D. Sharar, N. Jankowski, 2011, Robust Thermal Performance of a Flat-Plate Oscillating Heat Pipe During High-Gravity Loading, Journal of Heat Transfer, ASME, Vol. 133, pp. 104504-1–5.
Yew Mun Hung, Kek-Kiong Tio, 2012, Thermal Analysis of a Water-Filled Micro Heat Pipe with Phase-Change Interfacial Resistance, Journal of Heat Transfer, ASME, Vol. 134, pp. 112901-1–11.
Haizhen Xian, Yongping Yang, Dengying Liu, Xiaoze Du, 2010, Heat Transfer Characteristics of Oscillating Heat Pipe with Water and Ethanol as Working Fluids, Transactions of the ASME, Vol. 132, pp. 121501-1–6.
Lazarus Godson Asirvatham, Rajesh Nimmagadda, Somchai Wongwises, 2013, Operational Limitations of Heat Pipes with Silver–Water Nanofluids, Journal of Heat Transfer, ASME, Vol. 135, pp. 111011-1–10.
Taoufik Brahim, Abdelmajid Jemni, 2014, Effect of the Heat Pipe Adiabatic Region, Journal of Heat Transfer, ASME, Vol. 136, pp. 042901-1–10.
K. Nithyanandam, R. Pitchumani, 2014, Computational Studies on Metal Foam and Heat Pipe Enhanced Latent Thermal Energy Storage, Journal of Heat Transfer, ASME, Vol. 136, pp. 051503-1–10.
Jung-Chang Wang, 2011, L-Type Heat Pipes in Application in Electronic Cooling System, International Journal of Thermal Sciences, Vol. 50, pp. 97–105.
Tun-Ping Teng, How-Gao Hsu, Huai-En Mo, Chein, 2010, Thermal Efficiency of Heat Pipe with Alumina Nanofluid, Journal of Alloys and Compounds, Vol. 504S, pp. S380–S384.
Wukchul Joung, Taeu Yu, Jinho Lee, 2010, Experimental Study on the Operating Characteristics of a Flat Bifacial Evaporator, International Journal of Heat and Mass Transfer, Vol. 53, pp. 276–285.
Tian Shen Liang, Yew Mun Hung, 2010, Experimental Investigation on the Thermal Performance and Optimization of Heat Sink with U-Shape Heat Pipes, Energy Conversion and Management, Vol. 51, pp. 2109–2116.
F. C. Possamai, I. Setter, L. L. Vasiliev, 2009, Miniature Heat Pipes as Compressor Cooling Devices, Applied Thermal Engineering, Vol. 29, pp. 3218–3223.
Kwang-Soo Kim, Myong-Hee Won, Jong-Wook Kim, Byung-Joon Back, 2003, Heat Pipe Cooling Technology for Desktop PC CPU, Applied Thermal Engineering, Vol. 23, pp. 1137–1144.
Xue Zhihu, Qu Wei, 2014, Experimental Study on Effect of Inclination Angles on Ammonia Pulsating Heat Pipe, Chinese Journal of Aeronautics, Vol. 27(5), pp. 1122–1127.
Bhawna Verma, Vijay Lakshmi Yadav, Kaushal Kumar Srivastava, 2013, Experimental Studies on Thermal Performance of a Pulsating Heat Pipe with Methanol/DI Water, Journal of Electronics Cooling and Thermal Control, Vol. 3, pp. 27–34.

This work is licensed under a Creative Commons Attribution 4.0 International License.
All articles published in our journal are licensed under CC-BY 4.0, which permits authors to retain copyright of their work. This license allows for unrestricted use, sharing, and reproduction of the articles, provided that proper credit is given to the original authors and the source.