Advancements in Precursors, Materials, Deposition Techniques for Thin Film Research in Electronic Devices: A Mini Review

Abstract: The rise of two-dimensional (2D) materials such as graphene, transition metal dichalcogenides (TMDs), and hexagonal boron nitride (h-BN) has opened new pathways for flexible and wearable electronic devices. However, large-area, scalable, and defect-free deposition of 2D thin films remains a critical challenge for their practical integration. In this mini-review, we focus on emerging deposition methods for 2D materials in flexible electronics, including chemical vapor deposition (CVD), atomic layer deposition (ALD), molecular beam epitaxy (MBE), solution-based methods, and printing approaches. We provide a comparative assessment of cost, scalability, film quality, and compatibility with flexible substrates, highlighting both the promise and limitations of current approaches. We also discuss controversies, such as trade-offs between scalability and performance, and identify gaps where current deposition strategies fail. Finally, perspectives on future research directions are presented, emphasizing hybrid deposition approaches and environmentally benign processing routes.

2D materials, Flexible electronics, Deposition techniques, Graphene, TMDs, Scalability

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